Welcome to Questar – Contact Us

Headquarters

Questar Products International, Inc.

Ph: 925.461.0100

Fx: 925.461.0200

Email: info@questarproducts.com

Website: www.questarproducts.com

USA East Coast Representative Lyons & Associates

Doylestown, PA

Ph: 215.345.7915

Fx: 215.345.8089

Email: jackm.lyons@worldnet.att.net

USA Midwest and West Coast
Representatives
The IPS Group

Dallas, TX

Ph: 972.317.0320

Fx: 972.317.5475

Website: www.theipsgroup.net

U.K. Distributor

PDP Equipment, Ltd.

Eastbourne UK

Ph: 44.1323.412.178

Email: admin@pdpequipment.co.uk Website: www.pdpequipment.co.uk

France Distributor

Cefor Ingéniérie

Marcoussis France

Ph: 33.16931.3534

Fx: 33.16931.3523

Email: cefori@cefori.fr

Website: www.cefori.com

Santa Rita Road #270 • Pleasanton, CA 94566 • Ph. 925.461.0100 • Fax 925.461.0200

How can Questar help you today?

Check the appropriate boxes below, and click the Submit button at the bottom,
or call Questar today: 925-461-0100

(check all that apply)

My production volumes are increasing
I would like to improve my process consistency and overall quality
I continuously have jobs with a high wire count
I am interested in the best bang for the buck
I am looking for the lowest cost of ownership
I would prefer a machine that operates with off-the-shelf replacement components
I need a machine with flexibility and a rapid product changeover
My operators insist on a machine that is user friendly with a short learning curve
I need a machine with a pattern recognition systems
My customers are demanding that we have fine pitch capability
We currently are doing ball bumping and expect to do more
We are interested in developing security bond capability
We need to increase our bondable area (table travel)

I would like more service, training and process development support

I need more telephone technical support

I need our wire bonding machines to have remote diagnostic capability

Our current wire bonding machines do not have customizable software

We are currently producing the following devices:

Hybrid, multi-chip		Monolithic semiconductor
Photonic		Chip On Board
Sensor		Specialty / Custom device

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